As a molding process, isostatic pressing technology has the following characteristics compared with conventional molding technology:
1. The isostatically pressed product has a high density and is generally 5 to 15 higher than the one-way and two-way molding. The relative density of hot isostatic products can reach 99.8%~99.09%.
2. The density of the compact is uniform. In the press molding, uneven density distribution of the compact occurs regardless of whether it is one-way or two-way pressing. This change in density can often reach more than 10% when pressing complex shaped articles. This is due to the frictional resistance between the powder and the steel mold. The isostatical fluid medium transmits pressure equally in all directions. The wrap and the powder are generally compressed, the powder and the wrap have no relative motion, the frictional resistance between them is small, the pressure is only slightly decreased, and the density falling gradient is generally only 1% or less, so the billet can be considered uniform for the bulk density.
3. Because the density is uniform, so the length to diameter ratio can be unrestricted, which facilitate the production of rod-shaped, or thin and long tubular.
4, In isostatic pressing process, it generally do not need to add lubricant into the powder, which not only reduces the pollution of the product, but also simplifies the manufacturing process.
The series of special carbon graphite products produced by the company are widely used in traditional industrial fields such as metal smelting and processing, electronic semiconductor industry, high temperature industrial furnace treatment, etc., and more and more have been applied to rail transit, photovoltaic industry, lithium battery and other High-tech fields. The products have been sold to more than 50 regions including the United States, Japan, Germany and India, and have established long-term supply and demand relationships with many large domestic enterprises.
Technical index
| Bulk dencity | Average granularity | Pressure resistant strength | Flexural strength | Elastic Modulus | Thermal expansion coefficient 10-6/℃ | Resistivity | Ash * | Application |
MMCA-1 | 1.75 | 20 | 65 | 29 | 11 | 4.3 | 15 | 0.1 | Allotype product |
MMCA-2 | 1.80 | 20 | 70 | 30 | 12 | 4.5 | 15 | 0.1 | Photovoltaic, allotype |
MMCA-3 | 1.85 | 20 | 75 | 33 | 12 | 4.8 | 15 | 0.1 | Photovoltaic, allotype |
MMC-B1 | 1.80 | 8 | 75 | 35 | 12 | 4.5 | 15 | 0.1 | Semiconductor, EDM, optical fiber,Mold |
MMC-B2 | 1.85 | 8 | 80 | 38 | 12 | 5.0 | 15 | 0.1 | Semiconductor, EDM, optical fiber,Mold |
MMCB-3 | 1.77 | 5 | 78 | 35 | 12 | 5.0 | 15 | 0.1 | Electronic mold,EDM, electrode, Machinery Seal |
MMCB-4 | 1.83 | 5 | 85 | 40 | 13 | 5.5 | 15 | 0.1 | Electronic mold,EDM, electrode, Machinery Seal |
MMCD-1 | 1.80 | 20 | 75 | 28 | 12 | 4.5 | 15 | 0.1 | Continuous casting |
MMCD-2 | 1.85 | 20 | 80 | 30 | 12 | 5.0 | 15 | 0.1 | Continuous casting |
MMCD-3 | 1.80 | 7 | 80 | 32 | 13 | 4.8 | 15 | 0.1 | Continuous casting,EDM, machinery seal |
MMCD-4 | 1.85 | 7 | 85 | 38 | 13 | 5.5 | 15 | 0.1 | Continuous casting,EDM, machinery seal |
KWIH-1 | 1.90 | 8 | 105 | 53 | 12 | 4.2 | 15 | 0.1 | Hot bending die,EDM, machinery seal |
KWIH-2 | 1.95 | 5 | 115 | 57 | 12 | 4.2 | 15 | 0.1 | Hot bending die,EDM, machinery seal |